Semiconductor Manufacturing

“Sputtering (sputter coating) means a dusting of material from a solid by energetic ion bombardment with energetic ions to coat a substrate with the dusted material.”(www.IHS.com)

Physical Vapor Deposition (PVD) is also known as the magnetron sputtering process. Often used for processing semiconductor wafers, it is a stable vacuum coating process. To a large extent, properties of the layer can be determined by varying coating parameters. Sputter process technology has gained a high technical level using advance plasma systems and can also be used as a manufacturing process for mass production. Advantages of this process include:

• High homogeneity and purity of deposited layer
• High coating adhesion
• Independent orientation of coating source
• Environmentally friendly processing
• Flexibility of processing methods
• Flexibility of materials for coating
• Controlled layer deposition